Dipl.-Ing. Benjamin Spitschan
Leibniz Universität Hannover
Institut für Informationsverarbeitung
Appelstr. 9A
30167 Hannover
phone: +49 511 762-19586
fax: +49 511 762-5333
office location: room 1305

Benjamin Spitschan received his Dipl.-Ing. degree from Technische Universität Braunschweig with a focus on communications technology and signal processing. He interned at BSkyB, London, and Siemens Corporate Research, Princeton, USA, where he did research on consumer electronics and medical image processing, respectively. Benjamin Spitschan has joined the Institut für Informationsverarbeitung in July 2011 and is working on data storage and retrieval using micro-structured mechanical component surfaces.

Show selected publications only
  • Benjamin Spitschan, Jörn Ostermann
    Estimation of Radial Distortion Using Local Spectra of Planar Textures
    Proceedings of th 15th IAPR International Conference on Machine Vision Applications. May 8, 2017 - May 12, 2017, Nagoya, Japan, May 2017
  • Berend Denkena, Tobias Mörke, Max Krüger, Justin Schmidt, Haythem Boujnah, Johannes Meyer, Philipp Gottwald, Benjamin Spitschan, Maximilian Winkens
    Development and first applications of gentelligent components over their lifecycle
    CIRP Journal of Manufacturing Science and Technology, Elsevier, Vol. 7, No. 2, pp. 139-150, April 2014
  • Rolf Hockauf, Benjamin Spitschan, Tobias Mörke, Berend Denkena, Jörn Ostermann, Thilo Grove
    Die Zukunft der Bauteilidentifikation - Innovative Methode zur Nutzung oberflächeninhärenter Bauteilinformationen
    wt Werkstattstechnik online, Springer-VDI, Vol. 104, No. 11, pp. 753-756, 2014
  • Berend Denkena, Jörn Ostermann, Jens Köhler, Tobias Mörke, Benjamin Spitschan
    Product Identification by Machined Micro Patterns
    Int. J. of Automation Technology, Vol. 7, No. 6, pp. 735-741, 2013
  • Berend Denkena, Jörn Ostermann, Bernd Breidenstein, Tobias Mörke, Benjamin Spitschan
    Advanced machining and accessing of information by means of gentelligent micro patterns
    1st Joint International Symposium on System-integrated Intelligence: New Challenges for Product and Production Engineering, Hannover, June 2012
  • C. Jastrow, S. Priebe, B. Spitschan, J. Hartmann, M. Jacob, T. Kürner, T. Schrader, T. Kleine-Ostmann
    Wireless digital data transmission at 300 GHz
    Electron. Lett., Vol. 46, No. 9, pp. 661-663, 2010